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TDA1175P
LOW-NOISE VERTICAL DEFLECTION SYSTEM
FEATURES SUMMARY COMPLETE VERTICAL DEFLECTION SYSTEM

Figure 1. Package
LOW NOISE SUITABLE FOR HIGH DEFINITION MONITORS ESD PROTECTED
DESCRIPTION The TDA1175P is a monolithic integrated circuit in POWERDIP16 plastic package. It is intended for use in black and white and colour TV receivers. Low-noise makes this device particularly suitable for use in monitors. The functions incorporated are: synchronization circuit, oscillator and ramp generator, high power gain amplifier, flyback generator, voltage regulator. Figure 2. Pin Connections
POWERDIP16 (Plastic Package)
RAMP OUTPUT SUPPLY VOLTAGE FLYBACK GROUND GROUND POWER AMPLIFIER OUTPUT POWER AMPLIFIER SUPPLY VOLTAGE REGULATED VOLTAGE
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
RAMP GENERATOR COMPENSATION AMP. INPUT GROUND GROUND OSCILLATOR SYNC. INPUT HEIGHT ADJUSTMENT
REV. 2 April 2004 1/13
TDA1175P
Figure 3. Block Diagram
+ VS C4 DA
FREQ
P1
TDA1175P
11 OSCILLATOR
8
2
3
7 RH C9
VOLTAGE REGULATOR
FLYBACK GENERATOR
POWER AMPLIFIER
6 RG C8 YOKE
C1
SYNC
10
SYNC CIRCUIT
RAMP GENERATOR
BUFFER STAGE
PREAMPLIFIER
15 C5 C7 RE RD
4
5
12 13 TABS HEIGHT
9 C2 P2 RA
16 1 LINEARITY
14
P3 C3
RB
RC
C6
RF
Table 1. Absolute Maximum Ratings
Symbol VS V6, V7 V14 IO IO IO I3 I3 I10 PTOT TSTG , Tj Supply Voltage at Pin 2 Flyback Peak Voltage Power Amplifier Input Voltage Output Peak Current (non repetitive) at t = 2ms Output Peak Current at f = 50Hz, t 10s Output Peak Current at f = 50Hz, t > 10s Pin 3 DC Current at V6 < V2 Pin 3 Peak to Peak Flyback Current for f = 50Hz, tfly 1.5ms Pin 10 Current Power Dissipation at at Ttab = 90C Power Dissipation at Tamb = 70C (free air) (1) Storage and Junction Temperature Parameter Value 35 60 + 10 - 0.5 2 2.5 1.5 100 1.8 20 4.3 1 - 40 to 150 Unit V V V A A A mA A mA W W C
Table 2. Thermal Data
Symbol Rth (j-tab) Rth (j-amb) Parameter Thermal Resistance Junction-pin Max. Thermal Resistance Junction-ambient Max. Value 12 80 Unit C/W C/W(1)
Note: 1. Obtained with tabs soldered to printed circuit with minimized copper area.
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TDA1175P
ELECTRICAL CHARACTERISTICS (Tamb = 25C, unless otherwise specified) Table 3. DC CHARACTERISTICS (Refer to the test circuits, VS = 35V)
Symbol I2 I7 -I11 -I14 -I16 -I16 Parameter Pin 2 Quiescent Current Pin 7 Quiescent Current Oscillator Bias Current Amplifier Input Bias Current Ramp Generator Bias Current Ramp Generator Current I3 = 0 I6 = 0 V11 = 1V V14 = 1V V16 = 0 I9 = 20A, V16 = 0 18.5 Test Conditions Min. Typ. 7 8 0.1 1 0.02 20 Max. 14 17 1 10 0.3 21.5 Unit mA mA A A A A Fig. 5 5 4 5 4 5
I 16 --------I 16
VS V1 V3 V6
Ramp Generator Non-linearity
V16 = 0 to 12V, I9 = 20A
0.2
1
%
5
Supply Voltage Range Pin 1 Saturation Voltage to Ground Pin 3 Saturation Voltage to Ground Qiuescent output Voltage I1 = 1mA I3 = 10mA Vs = 10V, R1 = 1k, R2 = 1k Vs = 35V, R1 = 3k, R2 = 1k
10 1 1.5 4.1 8.2 4.4 8.8 0.9 1.8 1.4 2.8 6.5 I9 = 20A 6.6 6.7 6.8
35 14 2.5 4.7 9.4 1.2 2.2 2.1 3.1 6.9 7
V V V V V V V V V V V 4 4 4 6 6 7 7 5 5
V6L
Output Saturation Voltage to Ground
- I6 = 0.1A - I6 = 0.8A
V6H
Output Saturation Voltage to Supply
I6 = 0.1A I6 = 0.8A
V8 V9
Regulated Voltage at Pin 8 Regulated Voltage at Pin 9
V 8 V 9 ------------ -----------V S V S
V14
Regulated Voltage Drift with Supply Voltage
Vs = 10 to 35V
1
2
mV/V
5
Amplifier Input Reference Voltage
V10 0.4V
2.20
2.27
2.35
V
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TDA1175P
Table 4. AC CHARACTERISTICS (Refer to the AC test circuit, VS = 22V, f = 50Hz)
Symbol IS I10 V6 tfly VON fO fOPER f Parameter Supply Current Sync. Input Current (positive or negative) Flyback Voltage Flyback Time Peak to Peak Output Noise Free Running Frequency Operating Frequency Range Synchronization Range I10 = 0.5mA, C9 = 0.1F (P1+R1) = 300k VS = 10 to 35V IY = 1APP IY = 1APP Pin 11 Connected to GND (P1 + R1) = 300k C9 = 0.1 F 36 10 14 Test Conditions IY = 1APP 0.5 45 0.7 18 43.5 120 30 Min. Typ. 140 2 Max. Unit mA mA V ms mVpp Hz Hz Hz Fig. 8 8 8 8 8 8 8 8
f ---------V S f ----------T ab
Frequency Drift with Supply Voltage
0.00 5
Hz/V
8
Frequency Drift with tab Temperature
Ttab = 40 to 120C
0.01
Hz/C
8
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TDA1175P
DC TEST CIRCUITS Figure 4.
I3 +VS
Figure 6.
+ VS
V3
3 10
2
7 6 14 R1
2 11
7 6
I4
TDA1175P
11 I8 1 1V - I9 1V 8V 9 16 TABS - I12
TDA1175P
14 TABS
V4 R2
V4L 4V
Figure 5.
I2 +VS
Figure 7.
+ VS
I5 2 11 8 V6 7
2 11
7 6
V4H
TDA1175P
16 - I12
100k
14
TDA1175P
14 TABS
9
TABS V7 - I10 1V
I4 1V
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TDA1175P
Figure 8. AC Test and Application Circuit for Large Screen B/W TV Set 10/20mH/1APP
VS = 22V
0.1F 100F 7 3
1N4001 TABS 2
470F
0.1F 3.3 6 220k 15 100pF 5.6k Yoke Ry = 10 Ly = 20mH 1000F 5.6k 14 10F 22k 1 560*
SYNC. INPUT
10
470pF
TDA1175P
11 P1 100k R1 220k 8 100k 9 16
100k
47k
1.8k
0.1F C9 0.1F 120k 910k 0.1F *on application only 1
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TDA1175P
Figure 9. Typical Application Circuit for VGA Monitor (RY = 10, LY = 20mH, IY = 0.8APP)
C9 3.3nF C10 560pF R13 3.3 C11 0.1F 6 C8 22F 35V R7 27k R14 220F 1/2W C12 470F 50V
R12 220k
R11 2.7k
VS (26V) C1 0.1F C2 1000F 35V R1 3.3k D1 1N4007 7 C3 100F 35V 3 10 11 C4 0.15F 8 R2 82k P1 100k V.FREQ R5 200k C5 1.8F R3 240k P2 220k V. SIZE R4 1M C7 0.1F 9 16 4 15 2
14
Y1 YOKE
TDA1175P
R8 1 P3 50k 5 12 13 V.LIN R6 56k R10 0.82 47k R9 5.1k
C6 0.1F
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TDA1175P
Figure 10. P.C. Board and Components Layout of the Circuit of Figure 9 (1:1 scale)
V-SIZE
V-FREQ C9
C12 C18
R18
R12 P1
P2
R6 R9
C6
R2
R11
C2
C4 C11 R10
R1 D1
GND VS
C1
Y1 R8
C8 IC1
C3 P3 V.LIN
R14 R7
R4 C7
C6
R8 R6
R
Table 5. Bill of Material
Item 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Qty 4 1 1 1 1 1 1 1 1 1 1 1 1 1 Reference C1, C6, C7, C11 C2 C3 C4 C5 C8 C9 C10 C12 D1 IC1 P1 P2 P3 Part 0.1F 1000F 35V 100F 35V 0.15F 1.8nF 22F 35V 3.3nF 560pF 470F 50V 1N4007 TDA1175P 100k POT 220k POT 50kPOT
Item 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
Qty 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1
Reference R1 R2 R3 R4 R5 R6 R7 R8 R9 R10 R11 R12 R13 R14 Y1
Part 3.3k 82k 240k 1M 200k 56k 27k 47k 5.1k 0.82 2.7k 220k 3.3 220 1/2W YOKE
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TDA1175P
MOUNTING INSTRUCTION The Rth (j-a) can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Figure 11) or to an external heatsink (Figure 12). The diagram of Figure 13 shows the maximum dissipable power Ptot and the Rth (j-a) as a function of the side "I" of two equal square copper areas having a thicknessof 35 (1.4 mils). During soldering the pins temperature must not exceed 260C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. Figure 11. Example of P.C. Board Copper Area
COPPER AREA 35 THICKNESS
Figure 13. Maximum Power Dissipation and Junction-ambient Thermal Resistance versus "I"
G-3558 Ptot (W) 4 Rth (C/W) 80
3
Rth j - amb
60
2
40
1
Ptot (Tamb = 70C)
20
0 0 10 20 30 40 l (mm)
0
Figure 14. Maximum Allowable Power Dissipation versus Ambient Temperature
G-3559/2
Ptot
WIT
S-3181 P.C. BOARD
4
W IT H HE AT
H IN FINI
Figure 12. External Heatsink Mounting Example
17.0 mm
3
TE H
SI NK HA VI NG Rt
EAT SINK
2
h
= 25
FR
1
C
EE
/W
AIR
0 11.9 mm 38.0 mm -50 0 50 100 Tamb(C)
S-3474
9/13
TDA1175P
PART NUMBERING Table 6. Order Codes
Part Number TDA1175P Package POWERDIP16 Temperature Range -25 to 85 C
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TDA1175P
PACKAGE MECHANICAL Table 7. POWERDIP16 - Mechanical Data
millimeters Symbol Typ a1 B b b1 D E e e3 F i L Z 3.3 1.27 8.8 2.54 17.78 7.1 5.1 0.130 0.050 0.38 0.51 0.85 0.5 0.5 20 0.346 0.100 0.700 0.280 0.201 0.015 1.4 Min Max Typ 0.020 0.033 0.020 0.020 0.787 0.055 Min Max inches
Figure 15. POWERDIP16 - Package Dimensions
a1
I
b1 E
Z
b
B e3
e
D
16
9
1
8
Note: Drawing is not to scale
F
L
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TDA1175P
REVISION HISTORY Table 8. Revision History
Date August-1995 14-Apr-2004 Revision 1 2 First Issue Stylesheet update. No content change. Description of Changes
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TDA1175P
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2004 STMicroelectronics - All rights reserved STMicroelectronics GROUP OF COMPANIES Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States www.st.com
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